Оборудование для промышленной автоматизации

Встраиваемые системы — Страница 26

DDR3L 1333/1600/1867 ггц, SODIMM x 2 до 8ГБ. VGA x 1. Чипсет SoC
Mini-ITX, 14nm, FCBGA1356 7thGen Intel® Core™ processor family, 15~25W TDP. DDR4 SODIMM x 2, Up to 32GB.
Mini-ITX with Intel® 8th Generation Core™ LGA1151 Socket Processor, Max. 65W TDPs, 12V DC Power input. DDR4 SODIMM x 2, Up to 32 GB.
14nm. DDR4 SODIMM x 2, Up to 32GB. VGA x 1 или HDMI x 1. USB 3.0 x 4, 2 x RS-232/ 422 485
Формат Mini-ITX, ОЗУ DRAM, USB x 10, Max. 65W TDPs. DDR4 so-dimm x 2 до 32ГБ. Q370 Express Chipset
Intel® 5th Gen processor Nano-ITX Board With 2 DP, 1 LVDS and 7 USB port. USB 3.0 Port x 4, USB 2.0 Port x 3.
6th Generation Intel® Core™ 15W Processor Nano-ITX Board with HDMI x 2, LAN Port x 2, COM Port x 1 and USB Port x 4.
COM Express® R1.0, Pin-out Type 2. Multiple displays: 1 LVDS, 1 VGA. Rich I/O: 1 GbE, 8 USB 2.0, 4 COM. Supports Compact/Basic modules.
COM Express® R2.0, Pin-out Type 6. Multiple displays: 1 LVDS, 1 VGA, 2 DP. Rich I/O: 1 GbE, 4 USB 3.0, 4 USB 2.0, 4 COM.
COM Express® R2.0, Pin-out Type 2. Supports Compact/Basic modules. Multiple displays: 1 LVDS, 1 VGA. Rich I/O: 1 GbE, 8 USB 2.0, 4 COM. microATX form factor
COM Express® R2.1, Pin-out Type 6. Supports Compact/Basic modules. Multiple displays: 1 DP, 1 LVDS, 1 VGA. Rich I/O: 1 GbE, 6 USB. Mini-ITX form factor.
Mini-ITX form factor. COM Express® R2.1, Pin-out Type 10. Rich I/O: 1 GbE, 6 USB, 2 COM. Multiple displays: 1 DP, 1 LVDS. Supports Mini modules.
Qseven R1.2. Rich I/O: 1 GbE, 2 USB 2.0, 3 COM. Multiple displays: 1 LVDS, 1 HDMI. Supports Qseven modules.
Qseven R2.0. Rich I/O: 1 GbE, 1 USB 3.0, 6 USB 2.0, 2 COM. Multiple displays: 1 DP, 1 LVDS. Supports Qseven modules. Mini-ITX form factor.
COM Express® R2.1, Pin-out Type 6. Multiple displays: VGA, LVDS, DP, eDP. Rich I/O: 1 GbE, 4 USB 3.0, 4 USB 2.0. microATX form factor.
COM Express® R3.0, Pin-out Type 7. Rich I/O: 2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM. Multiple expansion: 8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0.