Процессорные платы — Страница 9
Модуль COM Express Type 10 с процессором Intel Core серии U 13-го поколения. Ориентирован на клиентов, которым требуется небольшое, гибкое и масштабируемое решение (84 x 55 мм). Применение: искусственный интеллект, камеры, датчики, периферийные устройства, роботы.
Модуль COM Express Type 10 с процессором Intel Core серии U 13-го поколения. Ориентирован на клиентов, которым требуется небольшое, гибкое и масштабируемое решение (84 x 55 мм). Применение: искусственный интеллект, камеры, датчики, периферийные устройства, роботы.
COM Express® R1.0, Pin-out Type 2. Multiple displays: 1 LVDS, 1 VGA. Rich I/O: 1 GbE, 8 USB 2.0, 4 COM. Supports Compact/Basic modules.
COM Express® R2.0, Pin-out Type 6. Multiple displays: 1 LVDS, 1 VGA, 2 DP. Rich I/O: 1 GbE, 4 USB 3.0, 4 USB 2.0, 4 COM.
COM Express® R2.0, Pin-out Type 2. Supports Compact/Basic modules. Multiple displays: 1 LVDS, 1 VGA. Rich I/O: 1 GbE, 8 USB 2.0, 4 COM. microATX form factor
COM Express® R2.1, Pin-out Type 6. Supports Compact/Basic modules. Multiple displays: 1 DP, 1 LVDS, 1 VGA. Rich I/O: 1 GbE, 6 USB. Mini-ITX form factor.
Mini-ITX form factor. COM Express® R2.1, Pin-out Type 10. Rich I/O: 1 GbE, 6 USB, 2 COM. Multiple displays: 1 DP, 1 LVDS. Supports Mini modules.
Qseven R1.2. Rich I/O: 1 GbE, 2 USB 2.0, 3 COM. Multiple displays: 1 LVDS, 1 HDMI. Supports Qseven modules.
Qseven R2.0. Rich I/O: 1 GbE, 1 USB 3.0, 6 USB 2.0, 2 COM. Multiple displays: 1 DP, 1 LVDS. Supports Qseven modules. Mini-ITX form factor.
COM Express® R2.1, Pin-out Type 6. Multiple displays: VGA, LVDS, DP, eDP. Rich I/O: 1 GbE, 4 USB 3.0, 4 USB 2.0. microATX form factor.
COM Express® R3.0, Pin-out Type 7. Rich I/O: 2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM. Multiple expansion: 8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0.
COM Express® R2.1, Pin-out Type 6. Rich I/O: 1 GbE, 4 USB 3.1, 4 USB 2.0. Multiple displays: VGA, LVDS, DP, eDP. microATX form factor.
Qseven R2.1. Rich I/O: 1 GbE, 3 USB 3.0, 8 USB 2.0, 2 COM. Multiple displays: 2 DP, 1 LVDS, 1 eDP. Supports Qseven modules.
3rd/2nd Gen Intel® Core™, Intel® QM67 Chipset. Dual channel DDR3 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 8 USB 2.0.
AMD® Embedded R-Series, AMD® A70M. Dual cha. nnel DDR3 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 4 USB 3.0, 4 USB 2.0.
3rd/2nd Gen Intel® Core™, Intel® QM77 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0.
3rd/2nd Gen Intel® Core™, Intel® QM77 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Multiple expansion: 1 PCIe x16, 4 SATA, 1 LPC, 1 I2C, 1 SMBus.
3rd/2nd Gen Intel® Core™, Intel® HM76 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 8 USB 2.0.
3rd/2nd Gen Intel® Core™, Intel® QM77 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 8 USB 2.0.
3rd Gen Intel® Core™, Intel® QM77 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0.
3rd/2nd Gen Intel® Core™, Intel® HM76 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0.
4th Gen Intel® Core™, Intel® QM87 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 8 USB 2.0.
4th Gen Intel® Core™, Intel® HM86 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 8 USB 2.0.
4th Gen Intel® Core™, Intel® QM87 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0.
4th Gen Intel® Core™, Intel® HM86 Chipset. Dual channel DDR3L 1600MHz SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0.
4th Gen Intel® Core™, Intel® QM87 Chipset. Dual channel DDR3L 1600MHz ECC SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0.
4th Gen Intel® Core™, Intel® HM86 Chipset. Dual channel DDR3L 1600MHz ECC SODIMM up to 16GB. Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0.
2nd Gen AMD® R-Series, AMD® A77E. Dual Channel DDR3L 1866MHz SODIMM up to 16GB. Multiple expansion: 1 PCIe x16, 7 PCIe x1, 1 LPC, 1 I2C, 1 SMBus.