Периферия и комплектующие — Страница 6
2.5” SATA III solution for industrial field. DWPD equals to 2.0. High IOPS with 3D NAND solution.
InnoREC soultion for surveillance application. 7mm height mechinicial design. Exclusive REC line for video recording.
The World’s first hybrid SSD with an Azure Sphere inside. End-to-end security from edge to cloud. Hardware level allows easy and simple development.
Compliant with the standard USB specifications. Compact size and varies in dimensions. Support Linux / WinCE/ XP Embedded/Win7 Embedded.
Compliant with the standard USB specifications. Compact size and varies in dimensions. Support Linux / WinCE/ XP Embedded/Win7 Embedded.
Compliant with the standard USB specifications. Compact size and varies in dimensions. Support Linux / WinCE/ XP Embedded/Win7 Embedded.
Compliant with the standard USB specifications. Compact size and varies in dimensions. Support Linux / WinCE/ XP Embedded/Win7 Embedded. Shock resistance and anit-vibration.
Compliant with the standard USB specifications. Compact size and varies in dimensions. Support Linux / WinCE/ XP Embedded/Win7 Embedded.
Compliant with the standard USB. 20-pin Connector, Pin-Pitch B. high-speed transmission.
USB 3.1 Gen1, поддержка функции S.M.A.R.T., а также технологии Chip-On-Board: водо-/влагостойкость, пыле- и ударопрочность.
USB3.0 с высокоскоростной передачей данных, поддержка функции S.M.A.R.T, усовершенствованные алгоритмы выравнивания износа.
USB 2.0 high-speed transmission. Advanced wear-leveling algorithms. ECC engine.
USB 2.0 high-speed transmission. Implements advanced wear-leveling algorithms ECC engine Power Saving implemented Optional Industrial temp. range -40°C to 85°C.
USB 3.0 c высокоскоростной передачей данных, поддержка функции S.M.A.R.T, усовершенствованные алгоритмы выравнивания износа.
USB 2.0 high-speed transmission. Advanced wear-leveling algorithms. ECC engine.
USB 2.0 high-speed transmission. Advanced wear-leveling algorithms. ECC engine.
Compliant with the standard USB. 20-pin Connector, Pin-Pitch B. High-speed transmission.
Built-in hardware ECC. Global wear-leveling. Flash bad-block management. S.M.A.R.T.
Built-in hardware ECC. Global wear-leveling. Flash bad-block management. S.M.A.R.T.
Built-in hardware ECC. Global wear-leveling. Flash bad-block management. S.M.A.R.T.
Built-in hardware ECC. Global wear-leveling. Flash bad-block management. S.M.A.R.T.
Built-in hardware ECC. Global wear-leveling. Flash bad-block management. S.M.A.R.T..
Built-in hardware ECC. Global wear-leveling. Flash bad-block management. S.M.A.R.T.
Built-in hardware ECC. Global wear-leveling. Flash bad-block management.
Adopts advanced LDPC ECC engine with 3D NAND flash memory to improve reliability. Global Wear Leveling. Flash bad-block management.
Adopts advanced LDPC ECC engine with 3D NAND flash memory to improve reliability. Global Wear Leveling. Flash bad-block management.
Adopts advanced LDPC ECC engine with 3D NAND SLC-liteX technology to improve reliability. Global Wear Leveling. Flash bad-block management.
Adopts advanced LDPC ECC engine with 3D NAND SLC-liteX technology to improve reliability. Global Wear Leveling. Flash bad-block management.
