Встраиваемые компьютеры с широким набором интерфейсов

Встраиваемый безвентиляторный компьютер на базе Intel® Core ™ 8-го/9-го поколения с TDP 65W/ 35W, компактный размер 212 х 165 х 63 мм

Встраиваемый промышленный компьютер TANK-610 от компании IEI на базе Intel® Celeron® N3160 ГГц, TDP=6W

DDR3L-1866 memory onboard + 1 SODIMM up to 8GB. Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB. Displays: 1 DP/HDMI combo + 1 DP/VGA.

4GB/8GB DDR4 memory onboard. 1x 2.5" SATA 3.0 drive bay. Rich I/O ports: 2 Intel GbE, 6 COM, 4 USB 3.0, 4 USB 2.0.

Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 8 COM, 8 USB 3.0, 2 USB 2.0, 1 M.2 NVMe slots. 3 expension slots: PCIe + PCI.

Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 4 PoE + 2 LAN, 5 COM, 4 USB 3.0, 2 USB 2.0, 1 M.2 NVMe slots. Supports 1 PCIe x16 or 1 PCI, 2 Mini PCIe.

Встраиваемый безвентиляторный компьютер EB100-KU на базе Intel® Core ™ 6-го/7-го поколения(Skylake-U/Kabylake-U)

Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.0, 2 USB 2.0, 1CFast. Supports 2 Mini PCIe and 1 M.2 NVMe slots.

Palm-sized and Fanless Embedded System. 2GB/4GB LPDDR4-2400 memory onboard. Rich I/O ports: 2 Intel GbE, 1 COM, 3 USB.

ARM-based Fanless Embedded System. 1GB/2GB DDR3L memory onboard. 8GB/16GB eMMC for storage. Rich I/O ports: 2 GbE, 2 COM, 2 USB 2.0, 1 USB OTG.

ARM-based Fanless Embedded System. 1GB/2GB DDR3L memory onboard. 8GB/16GB eMMC for storage. Rich I/O ports: 2 GbE, 2 COM, 2 USB 2.0, 1 USB OTG.

6th/7th Generation Intel® Core™ Fanless Embedded System. 4GB/8GB DDR4 memory onboard. Rich I/O ports: 2 PoE, 2 Intel GbE, 6 COM, 6 USB 3.0.

6th/7th Generation Intel® Core™ Fanless Embedded System. 4GB/8GB DDR4 memory onboard. Rich I/O ports: 2 Intel GbE, 4 COM, 4 USB 3.0. 1x 2.5" SATA 3.0 drive bay.

6th/7th Generation Intel® Core™ with Intel® Q170. Supports DDR4 SODIMM up to 32GB. 2 Mini PCIe slots support mSATA and Wi-Fi modules.

6th/7th Generation Intel® Core™ with Intel® Q170. Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 6 COM, 8 USB 3.0.

6th/7th Generation Intel® Core™ with Intel® Q170. Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.0, 2 USB 2.0.

4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. Rich I/O: 2 LAN, 6 COM, 6 USB. 1x 2.5" SATA drive bay

4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. 2x 2.5" SATA drive bays. 1 expansion slot: 1 PCIe x16 or 1 PCI.

4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. 2 expansion slots: 1 PCIe x16 + 1 PCI / 2 PCI. 2x 2.5" SATA drive bays

4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. 3 expansion slots: 2 PCIe x16 + 1 PCI / 2 PCI + 1 PCIe x16.