+7 (495) 225-98-16
Принимаем звонки с 9:00 до 17:30
(GTM+3)
+7 (495) 225-98-16
Принимаем звонки с 9:00 до 17:30
(GTM+3)
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Встраиваемый безвентиляторный компьютер на базе Intel® Core ™ 8-го/9-го поколения с TDP 65W/ 35W, компактный размер 212 х 165 х 63 мм
Встраиваемый промышленный компьютер TANK-610 от компании IEI на базе Intel® Celeron® N3160 ГГц, TDP=6W
DDR3L-1866 memory onboard + 1 SODIMM up to 8GB. Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB. Displays: 1 DP/HDMI combo + 1 DP/VGA.
4GB/8GB DDR4 memory onboard. 1x 2.5" SATA 3.0 drive bay. Rich I/O ports: 2 Intel GbE, 6 COM, 4 USB 3.0, 4 USB 2.0.
Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 8 COM, 8 USB 3.0, 2 USB 2.0, 1 M.2 NVMe slots. 3 expension slots: PCIe + PCI.
Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 4 PoE + 2 LAN, 5 COM, 4 USB 3.0, 2 USB 2.0, 1 M.2 NVMe slots. Supports 1 PCIe x16 or 1 PCI, 2 Mini PCIe.
Встраиваемый безвентиляторный компьютер EB100-KU на базе Intel® Core ™ 6-го/7-го поколения(Skylake-U/Kabylake-U)
Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.0, 2 USB 2.0, 1CFast. Supports 2 Mini PCIe and 1 M.2 NVMe slots.
Palm-sized and Fanless Embedded System. 2GB/4GB LPDDR4-2400 memory onboard. Rich I/O ports: 2 Intel GbE, 1 COM, 3 USB.
ARM-based Fanless Embedded System. 1GB/2GB DDR3L memory onboard. 8GB/16GB eMMC for storage. Rich I/O ports: 2 GbE, 2 COM, 2 USB 2.0, 1 USB OTG.
ARM-based Fanless Embedded System. 1GB/2GB DDR3L memory onboard. 8GB/16GB eMMC for storage. Rich I/O ports: 2 GbE, 2 COM, 2 USB 2.0, 1 USB OTG.
6th/7th Generation Intel® Core™ Fanless Embedded System. 4GB/8GB DDR4 memory onboard. Rich I/O ports: 2 PoE, 2 Intel GbE, 6 COM, 6 USB 3.0.
6th/7th Generation Intel® Core™ Fanless Embedded System. 4GB/8GB DDR4 memory onboard. Rich I/O ports: 2 Intel GbE, 4 COM, 4 USB 3.0. 1x 2.5" SATA 3.0 drive bay.
6th/7th Generation Intel® Core™ with Intel® Q170. Supports DDR4 SODIMM up to 32GB. 2 Mini PCIe slots support mSATA and Wi-Fi modules.
6th/7th Generation Intel® Core™ with Intel® Q170. Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 6 COM, 8 USB 3.0.
6th/7th Generation Intel® Core™ with Intel® Q170. Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.0, 2 USB 2.0.
4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. Rich I/O: 2 LAN, 6 COM, 6 USB. 1x 2.5" SATA drive bay
4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. 2x 2.5" SATA drive bays. 1 expansion slot: 1 PCIe x16 or 1 PCI.
4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. 2 expansion slots: 1 PCIe x16 + 1 PCI / 2 PCI. 2x 2.5" SATA drive bays
4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. 3 expansion slots: 2 PCIe x16 + 1 PCI / 2 PCI + 1 PCIe x16.