Встраиваемые компьютеры с широким набором интерфейсов — Страница 4
Fanless Embedded System with Intel® Atom™ Dual-core D2550 CPU. Supports 4 COM ports (3 x RS-232, 1 x RS-422/485).
Fanless Embedded System with Intel® Celeron® J1900 Processor. Supports four COM ports (three RS-232, one RS-422/485).
Fanless Embedded System with Intel® Atom™ Dual-core D525/N270 CPU.
Fanless Embedded System with Intel® Solution. Intel® Core™ i5/Celeron® CPU » Intel® Core™ i5-4400E 2.7 GHz/Celeron® 2000E 2.2 GHz. Triple video outputs » 2 x HDMI + VGA.
Fanless Embedded System with Intel® Solution. Two 2.5"" SATA 6Gb/s HDD/SSD drive bay. Operating temperature: -20°C ~ 60 °C. Two flexible E-Window for modularized expansion I/O.
Intel Atom® Processor E3800 Modular-Designed System. Supports DDR3L SODIMM up to 8GB. 2 expansion slots: PCIe x16 (x1 signal) and PCI expansions.
Intel Atom® Processor E3800 Modular-Designed System. Supports DDR3L SODIMM up to 8GB. 2x 2.5" SATA drive bays. 1 PCI expansion.
Intel Atom® Processor E3800 Modular-Designed System. Supports DDR3L SODIMM up to 8GB. 2x 2.5" SATA drive bays.
3rd/2nd Gen Intel® Core™ Modular-Designed System. Supports DDR3/DDR3L SODIMM up to 16GB. Up to 2x 2.5" SATA drive bay, 1 CF socket.
3rd/2nd Gen Intel® Core™ Modular-Designed System. Supports DDR3/DDR3L SODIMM up to 16GB. Up to 2x 2.5" SATA drive bay, 1 CF socket.
3rd/2nd Gen Intel® Core™ Modular-Designed System. Supports DDR3/DDR3L SODIMM up to 16GB. Up to 2x 2.5" SATA drive bay, 1 CF socket.
Intel Atom® Processor E3800. 4GB/2GB DDR3L onboard. 1x 2.5" SATA drive bay. 4x Gigabit LAN ports. Supports 3G/4G and GPRS application.
Intel Atom® Processor E3800. 4GB/2GB DDR3L ECC onboard. Supports Wi-Fi, 3G/4G, and GPRS application. 1x 2.5" SATA drive bay.
Intel® Xeon® Modular-Designed System. Supports DDR3 SODIMM up to 16GB. 3 expansion slots: 2 PCIe x16 + 1 PCI. 2x 2.5" SATA drive bays.
4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. 3 expansion slots: 2 PCIe x16 + 1 PCI / 2 PCI + 1 PCIe x16.
4th Gen Intel® Core™ Modular-Designed System. Безвентиляторный, i7/i5/i3, H81, 6 COM, 4 USB, 1 PCI, 1 PCIe x16, RoHS
4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. 2x 2.5" SATA drive bays. 1 expansion slot: 1 PCIe x16 or 1 PCI.
4th Gen Intel® Core™ Modular-Designed System. Supports DDR3 SODIMM up to 16GB. Rich I/O: 2 LAN, 6 COM, 6 USB. 1x 2.5" SATA drive bay
6th/7th Generation Intel® Core™ with Intel® Q170. Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.0, 2 USB 2.0.
6th/7th Generation Intel® Core™ with Intel® Q170. Supports DDR4 SODIMM up to 32GB. Rich I/O connectivity: 2 GbE, 6 COM, 8 USB 3.0.
6th/7th Generation Intel® Core™ with Intel® Q170. Supports DDR4 SODIMM up to 32GB. 2 Mini PCIe slots support mSATA and Wi-Fi modules.
6th/7th Generation Intel® Core™ Fanless Embedded System. 4GB/8GB DDR4 memory onboard. Rich I/O ports: 2 Intel GbE, 4 COM, 4 USB 3.0. 1x 2.5" SATA 3.0 drive bay.
6th/7th Generation Intel® Core™ Fanless Embedded System. 4GB/8GB DDR4 memory onboard. Rich I/O ports: 2 PoE, 2 Intel GbE, 6 COM, 6 USB 3.0.
ARM-based Fanless Embedded System. 1GB/2GB DDR3L memory onboard. 8GB/16GB eMMC for storage. Rich I/O ports: 2 GbE, 2 COM, 2 USB 2.0, 1 USB OTG.
ARM-based Fanless Embedded System. 1GB/2GB DDR3L memory onboard. 8GB/16GB eMMC for storage. Rich I/O ports: 2 GbE, 2 COM, 2 USB 2.0, 1 USB OTG.
Palm-sized and Fanless Embedded System. 2GB/4GB LPDDR4-2400 memory onboard. Rich I/O ports: 2 Intel GbE, 1 COM, 3 USB.
EC500-KH Fanless, KH263-QM175, I7-7820EQ, 4 COM, 6 USB, 2 LAN, -40 to +70C . DC 9~36V input, F/G SYSTEM RoHS
Встраиваемый безвентиляторный компьютер EB100-KU на базе Intel® Core ™ 6-го/7-го поколения(Skylake-U/Kabylake-U)
