Оборудование для промышленной автоматизации

Встраиваемые системы — Страница 41

COM Express Type 6 Basic Size with 6th/7th Gen Intel® Core™ i-series Processor. DDR4 SODIMM x 2, up to 32 GB, ECC Supports by SKU.
COM Express Type 6 Basic Size with 7th Gen. Intel® XEON E3 Processors. DDR4 SODIMM x 2, up to 32 GB, ECC Supports by SKU.
COM Express Type 6 Compact Size with 6th/7th Gen Core U-series Processor. DDR3L SODIMM x 1, up to 8 GB, non-ECC only.
COM Express Type 10 with 7th Generation Intel® Core™ ULT Series Processor. Onboard 4GB DDR4 2133 Memory.
COM Express Type 10 with 7th Generation Intel® Core™ ULT Series Processor. Onboard 8GB DDR4 2666 Memory.
COM Express Type 10 Module with Intel® Atom™ SoC. Onboard Memory LPDDR4 4GB/8GB.
COM Express Type 10 with 8th Generation Intel® Core™ ULT Series Processor. Onboard DDR4 memory, up to 8GB.
PFM-CVS, PC/104+ Module with Intel® Atom™ N2600 Processor. 204-pin DDR3 800/1066 MHz SODIMM x 1, Up to 2 GB.
3.5" SubCompact Board With Intel® Atom™ N455/ D525 Processor. DDR3 800 SODIMM, Max. 4 GB For Intel® Atom™ D525; DDR3 800 SODIMM, Max. 2 GB For Intel® Atom™ N455.
COM Express Type 6 CPU Module with Onboard Intel® Atom™/ Celeron® Processor SoC. DDR3L 1066/1333 MHz SODIMM x 1, Up to 8 GB.
COM Express Type 10 CPU Module with Onboard Intel® Atom™ Processor SoC. Onboard DDR3L 2 GB Memory (Optional to 4 GB).
COM Express Type 10 with 6th Generation Intel® Core™ ULT Series Processor. Onboard 4GB DDR4 2133 Memory. USB 3.0 x 2, USB 2.0 x 8.
3.5” SubCompact Board with Intel® Core™ i7/i5/i3/Celeron® Processor SoC. DDR4 1866/2133, SODIMM x 1.
3.5" BIO Daughter Board with PoE, USB 3.0
2.5” BIO Daughter Board with COM x 4, Mini-Card, SIM and USB.
2.5” BIO Daughter Board with MiniCard x1, SIM x1 and USB x1. SIM slot x1. USB 2.0 x1. SMbus x1, GPIO x1.